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| Flip-Chip Technologies Market Poised to Reach $57.04 billion by 2020 Says a New Research Report Available at WiseGuyReports.com | ||
| By: PR Newswire Association LLC. - 12 Feb 2016 | Back to overview list |
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PUNE, India, Feb. 12, 2016 /PRNewswire-iReach/ -- Global Flip-Chip Technologies market is estimated at $25.89 billion in 2015 and is poised to reach $57.04 billion by 2022, growing at a Compound Annual Growth Rate (CAGR) of 11.94% during the forecast period. Flip chip is a key technology for advanced packaging of microelectronic circuits and other micro-devices. This technology is used to interconnect semiconductor IC with other ICs, peripheral circuits or substrate in efficient way by solving the heat transfer problem of semiconductor devices, improving performance at higher frequency and reducing the power consumption. Wide range of low-end and high-end electronic products, enhanced electrical performance and high interconnection density are the major factors favoring the market growth. Photo - http://photos.prnewswire.com/prnh/20160211/332436LOGO Complete Report Details at https://www.wiseguyreports.com/reports/flip-chip-technologies-global-market-outlook-2015-2022. Due to a global trend on banning the toxic material lead in electronic products, conventional flip chip assembly using lead-based solder bumps is facing a great challenge. Flip chip technology continues to advance and is playing a huge role in 2.5D interposers and 3DICs. The demand for copper pillars and microbumps are reshaping the Flip chip technology, which are swiftly becoming the innovative conventional bumping metallurgy solutions for die interconnections. Intel is the leading producer of flip chip. It is estimated that, by the year 2017 more than half of all bumped wafers for flip chips will be made with copper pillars. Some of the key players in the global market include IBM Corp., Samsung Electronics Co. Ltd., Texas Instruments Inc., Amkor Technology Inc., Intel Corp., Taiwan Semiconductor Manufacturing Co., Global Foundries U.S. Inc., Powertech Technology Inc. and Advanced Semiconductor Engineering Inc, Nepes Pte. Ltd., Stmicroelectronics NV (STM) and Stats Chippac Ltd. Order a Purchase Copy @ https://www.wiseguyreports.com/checkout?currency=one_user-USD&report_id=339153. (Single User License – USD 4150) Wafer Bumping Process Covered:
End Use Covered:
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What our report offers:
Request a Sample Copy @ https://www.wiseguyreports.com/sample_request/flip-chip-technologies-global-market-outlook-2015-2022. (Single User License – USD 4150) Contact for More Information at sales@wiseguyreports.com or +1 (646) 845 9349 (US) and +44 208 133 9349 (UK) About Us Wise Guy Reports is part of the Wise Guy Consultants Pvt. Ltd. and offers premium progressive statistical surveying, market research reports, analysis & forecast data for industries and governments around the globe. We also provide COTS (Commercial off the Shelf) business sector reports as custom exploration agreeing your particular needs. Media Contact: Norah Trent, WiseGuy Reports, +1 646 845 9349, sales@wiseguyreports.com News distributed by PR Newswire iReach: https://ireach.prnewswire.com SOURCE WiseGuy Reports 
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